filtered and then subtracted from the original slice to flatten
the noise “phantoms.” From the sample slice in the vertical
plane, the smoothing process does not change the intensity
of the main lobe response. Since the noise floor is identi-
fied in each transverse plane, the volumetric intensity map
can finally be projected onto the transverse plane such that
the high intensity pixels are coherently added up, while the
lower intensity pixels remain at their intensity levels. Shown
in Figure 7d, after converting the grayscale image to decibel
levels, the example transverse defect is finally identified with a
high contrast.
At this point of the processing, it is necessary to isolate the
flaw from the background image. The critical step to highlight
the edge of the flaw is to apply a decibel level threshold and
convert the intensity map into a binary map. Typically, the
threshold is chosen as –15 dB for a ~30 dB dynamic range SAF
image, but the value should be adaptive to various circum-
stances such as defect orientation, reflectivity, SNR, and so
forth. In this paper a dynamic threshold level is determined
through the following empirical equation:
(3) Threshold =a +b *cos(θdefect) +c *noise
where
{a, b, c} are empirical constants calibrated from ground truth
results from known flaws,
θdefect is the incident angle of the acoustic beams on the flaw,
and
noise is the decibel level of the background phantom deter-
mined in the flattening process.
To find the incident angle θdefect, the algorithm first
approximates the tilted angle φ of the flaw using the initial 3D
ME
|
RAILROADS
10
20
60 70 80 90 100
30
40
Length y (mm)
10
Vertical plane Transverse plane
Morphology
Filter
Binary
20
–20 –10 0
Horizontal plane
(x-y)
Defect
Artifact
Vertical plane
SAF image slices
(y-z)
Transverse plane
Final defect image
(x-z)
10 20
30
40
Transverse x (mm)
3D
10
20
60 70 80 90 100
30
40
Length y (mm)
10
20
–20 –10 0 10 20
30
40
Transverse x (mm)
10
20
–20 –10 0 10 20
30
40
Transverse x (mm)
10
20
–20 –10
Project to 2D
0 10 20
30
40
–10
0
–20
–30
Transverse x (mm)
3D
10
20
60 70 80 90 100
30
40
Length y (mm)
10
20
–20 –10 0 10 20
30
40
Transverse x (mm)
3D
x
z
y
Figure 7. Volumetric image post-processing flowchart.
56
M A T E R I A L S E V A L U A T I O N • J A N U A R Y 2 0 2 4
2401 ME January.indd 56 12/20/23 8:01 AM
Depth
z
(mm)
Depth
z
(mm)
Depth
z
(mm)
Depth
z
(mm)
Depth
z
(mm)
Depth
z
(mm)
Depth
z
(mm)
Depth
z
(mm)
the noise “phantoms.” From the sample slice in the vertical
plane, the smoothing process does not change the intensity
of the main lobe response. Since the noise floor is identi-
fied in each transverse plane, the volumetric intensity map
can finally be projected onto the transverse plane such that
the high intensity pixels are coherently added up, while the
lower intensity pixels remain at their intensity levels. Shown
in Figure 7d, after converting the grayscale image to decibel
levels, the example transverse defect is finally identified with a
high contrast.
At this point of the processing, it is necessary to isolate the
flaw from the background image. The critical step to highlight
the edge of the flaw is to apply a decibel level threshold and
convert the intensity map into a binary map. Typically, the
threshold is chosen as –15 dB for a ~30 dB dynamic range SAF
image, but the value should be adaptive to various circum-
stances such as defect orientation, reflectivity, SNR, and so
forth. In this paper a dynamic threshold level is determined
through the following empirical equation:
(3) Threshold =a +b *cos(θdefect) +c *noise
where
{a, b, c} are empirical constants calibrated from ground truth
results from known flaws,
θdefect is the incident angle of the acoustic beams on the flaw,
and
noise is the decibel level of the background phantom deter-
mined in the flattening process.
To find the incident angle θdefect, the algorithm first
approximates the tilted angle φ of the flaw using the initial 3D
ME
|
RAILROADS
10
20
60 70 80 90 100
30
40
Length y (mm)
10
Vertical plane Transverse plane
Morphology
Filter
Binary
20
–20 –10 0
Horizontal plane
(x-y)
Defect
Artifact
Vertical plane
SAF image slices
(y-z)
Transverse plane
Final defect image
(x-z)
10 20
30
40
Transverse x (mm)
3D
10
20
60 70 80 90 100
30
40
Length y (mm)
10
20
–20 –10 0 10 20
30
40
Transverse x (mm)
10
20
–20 –10 0 10 20
30
40
Transverse x (mm)
10
20
–20 –10
Project to 2D
0 10 20
30
40
–10
0
–20
–30
Transverse x (mm)
3D
10
20
60 70 80 90 100
30
40
Length y (mm)
10
20
–20 –10 0 10 20
30
40
Transverse x (mm)
3D
x
z
y
Figure 7. Volumetric image post-processing flowchart.
56
M A T E R I A L S E V A L U A T I O N • J A N U A R Y 2 0 2 4
2401 ME January.indd 56 12/20/23 8:01 AM
Depth
z
(mm)
Depth
z
(mm)
Depth
z
(mm)
Depth
z
(mm)
Depth
z
(mm)
Depth
z
(mm)
Depth
z
(mm)
Depth
z
(mm)