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NOVEMBER 2022 Volume 80 • Number 11 JOURNAL STAFF PUBLISHER: Neal J. Couture, CAE DIRECTOR OF PUBLICATIONS/ EDITOR: Jill Ross ASSOCIATE EDITOR: Cara Markland PRODUCTION MANAGER: Joy Grimm GRAPHIC DESIGNER/ ILLUSTRATOR: Synthia Jester ASNT MEDIA & EVENT SALES Holly Klarman, MCI Group: holly.klarman@wearemci.com 1-410-584-8576 TECHNICAL EDITOR John Z. Chen, KBR ASSOCIATE TECHNICAL EDITORS John C. Aldrin, Computational Tools Sreenivas Alampalli, Stantec Ali Abdul-Aziz, Kent State University Narendra K. Batra, Naval Research Laboratory (retired) Dave Farson, Ohio State University Trey Gordon, SpaceX Cara A.C. Leckey, NASA Langley Research Center Mani Mina, Iowa State University Ehsan Dehghan-Niri, New Mexico State University Yi-Cheng (Peter) Pan, Emerson Inc. Anish Poudel, MxV Rail Donald J. Roth, Roth Technical Consulting LLC Ram P. Samy, Birring NDE Center Inc. Steven M. Shepard, Thermal Wave Imaging Ripi Singh, Inspiring Next Surendra Singh, Honeywell Roderic K. Stanley, NDE Information Consultants Mike C. Tsao, University of Connecticut – Avery Point Lianxiang Yang, Oakland University Reza Zoughi, Iowa State University CONTRIBUTING EDITORS Toni Bailey, TB3NDT Consulting Bruce G. Crouse, Inspection Services Huidong Gao, PEMEX Deer Park Saptarshi Mukherjee, Lawrence Livermore National Laboratory Hossein Taheri, Georgia Southern University UPFRONT | SCANNER There is no doubt that the powerful and versatile DIC technique will find mo e and more applications in various new areas in the future. FUTURE OF DIGITAL IMAGE CORRELATION With great pleasure and enthusiasm, I share with you this editor’s note outlining the emergence of a relatively advanced NDT inspection meth- odology: a high-speed, noncontact image optical instrument called digital image correlation (DIC). New technologies to assist in materials testing, characterization, and inspection continue to be in high demand, primarily from materials devel- opers, engine makers, and aerospace and other related industries. These technologies are needed to provide accurate data for identifying and modeling materials failure, mechanical behavior, and fatigue characteris- tics in addition to evaluating damages from harsh operating conditions. Based on known exerted mechanical or thermal loadings and measured kinematic fields, various static, structural, and dynamic constitutive param- eters of the materials under test (such as Young’s modulus, Poisson’s ratio, coefficient of thermal expansion, stress intensity factor, etc.) can be readily determined. Results can be further enhanced by combining DIC with identification methods such as the virtual fields method or finite element method (FEM). DIC employs a technique that enables full-field shape, displacement, and deformation measurements. DIC techniques first acquire digital images of an object at different loadings (times or states) using digital imaging devices (including but not limited to optical imaging, electronic imaging, and scanning probe imaging, such as SEM or high-speed cameras), and then perform image analysis with correlation-based matching algorithms and numerical differentiation approaches to quanti- tatively extract full-field displacement and strain responses from materials, components, structures, or biological tissues. The outlook for such an inspection technique is very promising. Developers are continuously striving to upgrade the technology, intensify the resolution, improve the data acquisition procedure and analysis soft- ware, and refine the detection algorithms. DIC is considered to be a revo- lutionary advance according to the experimental mechanics community, and the most important advance since the strain gauge. I believe it will continue to be the most practical and powerful deformation measuring tool for the foreseeable future. There is no doubt that the powerful and versatile DIC technique will find more and more applications in various new areas in the future. Possible developments that could make DIC a more useful and incisive technique include improved resolution, further automation, and more user-friendly and versatile software interfaces. In addition to 2D-DIC and 3D-DIC, true three-dimensional (or volu- metric) imaging is an innovation currently in the making in a broad range of fields including biomechanics, fracture mechanics, and materials testing and science. What was essentially absent from the NDT inspection toolbox is starting to be revealed. By performing ex situ or in situ mechanical tests, it is now possible to monitor material deformations in bulk in a nondestruc- tive way, thanks to digital volume correlation (DVC) analyses. ALI ABDUL-AZIZ, PHD, PE FOCUS ISSUE EDITOR AABDULA3@KENT.EDU N O V E M B E R 2 0 2 2 • M AT E R I A L S E V A L U AT I O N 7